IGBT module packaging barrier: the difficulty lies in high reliability

In recent years, with the rapid development of new energy vehicles, IGBT, as the main cost component of the controller for new energy vehicles, has also ushered in an outbreak. It is expected that by 2025, China's IGBT market will reach 52.2 billion yuan, with a compound annual growth rate of nearly 20%. However, from the perspective of design and manufacturing, looking at the status quo of the global automotive IGBT industry, almost 70% of the current market share has been scraped by Europe, the United States, Japan and other countries. The development of domestic IGBT design and manufacturing capacity is uneven, of course, there are many of them to keep up with the pace, continuous technological innovation, and obtain their own value and self-breakthrough national enterprises, Shenzhen Fuyingda is one of them.

What is car grade IGBT Package? It is defined as a power electronic device specifically used in the field of new energy vehicles. It has the characteristics of high efficiency, high reliability, high temperature resistance and long life, and is one of the key components in new energy vehicles and traditional vehicles. Due to the harsh working environment of the car, and may face strong vibration conditions, for the vehicle gauge IGBT, the requirements in temperature shock, temperature cycle, power cycle, temperature resistance and other standards are much higher than industrial and consumer grade. IGBT package from the chip to the completion of the package mainly through the following processes: Screen printing - automatic placement - vacuum reflow welding - ultrasonic cleaning - defect detection (X-ray) - automatic lead bonding - Laser marking - shell sealing - power terminal bonding - shell filling and curing - terminal forming - functional testing, each process link compared to other process technology, its technical difficulty coefficient is quite high.

Especially IGBT module, its high reliability design and packaging process control are technical difficulties. The IGBT module has the characteristics of long service time, and the service time of the automotive grade module can be up to 15 years. Therefore, in the packaging process, the module has very high requirements for product reliability and quality stability. High reliability design needs to consider material matching, efficient heat dissipation, low parasitic parameters, high integration and other factors. Package process control also includes low cavity rate welding/sintering, high reliability interconnection, ESD protection, aging screening and other links. In addition to module technology, vehicle electronic component failure is also a common technical problem, the study found that the cause of vehicle electronic component failure is partly from the "welding defect". Common welding defects such as: holes, pillow defects, non-wetting open circuit, dendrite growth, cracking and warping.

The above mentioned technical difficulties are nothing more than around high reliability to carry out, how to ensure the high reliability of IGBT packaging, Fuyingda dare to be the first, the courage to innovate, always walk in the forefront of Chinese national brands, speak with technology, I can Do it! The newly launched SAC High Reliability solder (FHR-209) can solve the full range of IGBT packaging process high reliability problems:

This product has the following advantages:

1. Good high and low temperature cycle impact reliability, melting point at 214-225°C, close to the melting point of SAC305;

2. Good shear strength and bonding thrust, whose shear force is greater than the thrust of SAC305;

3. Very low cavity rate, cavity rate <10%;

4. Good wettability;

5. After TS@500 cycles, the solder joint is normal and no cracks appear.

Specific parameter indicators can be detailed:

Into Fuyingda:

Fuyingda Company is a microelectronics and semiconductor packaging alloy solder solution provider, national high-tech enterprises, the Ministry of Industry and Information Technology electronics industry solder powder standard setting leading unit, Shenzhen "special fine special new" enterprise and national special fine special new "small giant" enterprise, since 1997 focused on microelectronics and semiconductor packaging alloy solder industry. Products include solder paste, solder glue and alloy welding powder. The products are widely used in various fields of microelectronics and semiconductor packaging. It has been widely recognized by SMT electronic chemicals, microphotonics and semiconductor packaging manufacturers worldwide. Offering a complete product line from alloy welding powder to application products, Fuyingda is the world's only manufacturer of electronic grade packaging materials that can manufacture T2-T10 full-size ultra-alloy welding powder.